Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2008-03-03
2010-11-16
Arbes, C. J (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S827000, C029S832000, C257S676000, C257S686000
Reexamination Certificate
active
07832092
ABSTRACT:
A printed wiring board includes a plurality of conductor plates that includes at least one conductor plate that is used as a lead for electrical connection with an external circuit, the conductor plates being separated spatially from one another; an insulating layer formed on or across the conductor plates or both on and across the conductor plates; and a plurality of wiring patterns formed on the insulating layer. At least one of the conductor plates is electrically connected with at least one of the wiring patterns through a via-hole.
REFERENCES:
patent: 4845313 (1989-07-01), Endoh et al.
patent: 4949225 (1990-08-01), Sagisaka et al.
patent: 5483100 (1996-01-01), Marrs et al.
patent: 5594626 (1997-01-01), Rostoker et al.
patent: 5661086 (1997-08-01), Nakashima et al.
patent: 5780926 (1998-07-01), Seo
patent: 5844307 (1998-12-01), Suzuki et al.
patent: 5869898 (1999-02-01), Sato
patent: 6340839 (2002-01-01), Hirasawa et al.
patent: 6531775 (2003-03-01), Kobayashi et al.
patent: 7169327 (2007-01-01), Ito et al.
patent: 7208826 (2007-04-01), Sakamoto et al.
patent: 2002/0168152 (2002-11-01), Abe et al.
patent: 2003/0015718 (2003-01-01), Nakanishi et al.
patent: 2003/0034498 (2003-02-01), Takagi
patent: 2 331 970 (2002-07-01), None
patent: 03-209861 (1991-09-01), None
patent: HEI 6-097318 (1994-04-01), None
patent: 9-260560 (1997-10-01), None
patent: 2001-194387 (2001-07-01), None
patent: 2001-36182 (2002-07-01), None
Iwase Masayuki
Shirai Takehiro
Arbes C. J
Oblon, Spivak McClelland, Maier & Neustadt, L.L.P.
The Furukawa Electric Co. Ltd.
LandOfFree
Method of manufacturing a printed wiring board lead frame... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing a printed wiring board lead frame..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a printed wiring board lead frame... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4152275