Method of manufacturing a printed wiring board having a...

Details Method of manufacturing a printed wiring board having a... Method of manufacturing a printed wiring board having a...

2003-02-19

2009-06-30

Chang, Rick K (Department: 3726)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C427S097700, C174S254000

Reexamination Certificate

active

07552531

ABSTRACT:
A method of producing a printed wiring board comprising innerlayer conductor circuits among insulating layers and blind via-holes formed by irradiating laser beams from the outermost surface of the insulating layer toward the innerlayer conductor circuit. A central portion of the innerlayer conductor circuit contains a previously formed opening hole located at the bottom of the blind via-hole. Thereafter, a metal plated film is formed on surfaces of the innerlayer conductor circuits and the blind via-holes.

REFERENCES:
patent: 3571923 (1971-03-01), Shaheen et al.
patent: 4258468 (1981-03-01), Balde
patent: 4642160 (1987-02-01), Burgess
patent: 4729061 (1988-03-01), Brown
patent: 4894115 (1990-01-01), Eichelberger et al.
patent: 4935584 (1990-06-01), Boggs
patent: 5034569 (1991-07-01), Gofuku et al.
patent: 5191174 (1993-03-01), Chang et al.
patent: 5227013 (1993-07-01), Kumar
patent: 5347712 (1994-09-01), Yasuda et al.
patent: 5438478 (1995-08-01), Kondo et al.
patent: 5578341 (1996-11-01), Hirosawa
patent: 5729897 (1998-03-01), Schmidt et al.
patent: 5826330 (1998-10-01), Isoda et al.
patent: 41 29 835 (1993-03-01), None
patent: 0 180 183 (1986-05-01), None
patent: 0 471 938 (1992-02-01), None
patent: 0 694 968 (1996-01-01), None
patent: 2 423 953 (1979-11-01), None
patent: A 58-64097 (1983-04-01), None
patent: A 62-216297 (1987-09-01), None
patent: A 3-54885 (1991-03-01), None
patent: A-03-165093 (1991-07-01), None
patent: A 3-165594 (1991-07-01), None
patent: A-03-211791 (1991-09-01), None
patent: A 4-5891 (1992-01-01), None
patent: A 04-162796 (1992-06-01), None
patent: A 4-186741 (1992-07-01), None
patent: A-04-250695 (1992-09-01), None
patent: A 5-75253 (1993-03-01), None
patent: A 5-102641 (1993-04-01), None
patent: A 6-302965 (1994-10-01), None
patent: A 08-330734 (1996-12-01), None
patent: A 9-130049 (1997-05-01), None
patent: A-09-172261 (1997-06-01), None
patent: A 9-199861 (1997-07-01), None
patent: A-10/190233 (1998-07-01), None
patent: A 10-224041 (1998-08-01), None
Pargellis A. N. et al., “Formation fo Microvias in Epoxy-Glass Composites by Laser Ablation”, Optics and Laser Technology, Elsevier Science Publishers BV., Amsterdam, NL, vol. 22, No. 3, Jun.1, 1990, pp. 205-207.
Kestenbaum A. et al., “Laser Drilling of Microvias in Epoxy-Glass Printed Circuit Boards”, IEEE Transactions on Components, Hybrids, and Manufacturing Technology, IEEE Inc. New York, vol. 13, No. 4, Dec. 1, 1990, pp. 1055-1062.
IBM Corporation, “Heat Sink Attach Process for Surface Mounted Technology, Tape Automated Bonding and Card on Board Devices”, IBM Technical Disclosure Bulletin, vol. 39, No. 4, Apr. 1, 1996, p. 99.

Affiliated with

Also associated with

Rating

Method of manufacturing a printed wiring board having a... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a printed wiring board having a..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a printed wiring board having a... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4147671