Method of manufacturing a printed wiring board

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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Details

C029S830000, C029S831000, C029S846000, C029S852000, C174S260000

Reexamination Certificate

active

07849591

ABSTRACT:
A configuration according to the invention includes at least one wired base material configured with an insulating base material having an adhesion property, and an electric conductive layer formed on one side of the insulating base material, a plugging electrode made of an electric conductive paste, connected to the electric conductive layer, and penetrating the insulating base material, and an IC chip having a re-wiring portion, the IC chip being buried in an interlayer binding material, with the re-wiring portion connected to the plugging electrode, having a supporting board disposed on an opposite side to the re-wiring portion of the IC chip, with an adhesion layer in between, and having a re-wiring layer configured with the wired base material and the re-wiring portion.According to the invention, therefore, it is allowed to provide a multi-layer printed wing board with highly defined components implemented, allowing for a fabrication by facile processes, without causing, among others, increased costs or decreased yields.

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patent: 2004-152963 (2004-05-01), None
patent: 2004-266094 (2004-09-01), None
patent: 2005-150344 (2005-06-01), None

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