Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor
Reexamination Certificate
2005-12-06
2005-12-06
Mayes, Melvin (Department: 1734)
Adhesive bonding and miscellaneous chemical manufacture
Methods
Surface bonding and/or assembly therefor
C427S096400, C174S257000, C174S264000
Reexamination Certificate
active
06972070
ABSTRACT:
A heated and pressed printed wiring board is made by filling via holes formed in layers of insulating film of the wiring board with an interlayer conducting material. The insulating film is stacked with conductor patterns, and each conductor pattern closes a via hole. The interlayer conducting material forms a solid conducting material in the via holes after a heating a pressing procedure. The solid conducting material includes two types of conducting materials. The first type of conducting material includes a metal, and the second type of conductive material includes an alloy formed by the metal and conductor metal of the conductor patterns. The conductor patterns are electrically connected reliably without relying on mere mechanical contact.
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S.K. Kang et al. “Development of Conductive Adhesive Materials for Via Fill Applications”, 2000 Electronic Components and Technology Conference, 2000, pp. 887-891.
Harada Toshikazu
Kondo Koji
Shiraishi Yoshihiko
Yazaki Yoshitaro
Yokochi Tomohiro
Denso Corporation
Mayes Melvin
Posz Law Group , PLC
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