Method of manufacturing a printed wiring board

Metal working – Method of mechanical manufacture – Electrical device making

Patent

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Details

174261, 361748, 361750, H05K 302

Patent

active

053456734

ABSTRACT:
A method of manufacturing a printed wiring board is disclosed. The method comprises the steps of forming a printed circuit on a substrate, coating an insulating layer on at least a part of the printed circuit, coating a shield layer on at least a part of the insulating layer, and forming the shield layer by a halftone dot.

REFERENCES:
patent: 3619899 (1971-11-01), Takeda et al.
patent: 5195238 (1993-03-01), Kawakami et al.

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