Method of manufacturing a printed wiring board

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29413, 294261, 29852, H05K 302

Patent

active

052749150

ABSTRACT:
The invention has been achieved to solve the problem mentioned above. The object of the invention is to provide a novel method of manufacturing a printed wiring board by allowing manufacturers to provide a slit and perforations on the substrate without causing even the slightest crack to be generated in the course of manufacturing the printed wiring board.
In the course of manufacturing printed wiring boards splittable across a slit and perforations,the method embodied by the invention executes those sequential steps including the following; provision of thickness adjusting film for specific regions adjacent to the slit and perforations; adjustment of the thickness of a main substrate and a splittable substrate which is splittable by means of the slit and the perforations; and formation of the slit and the perforations by applying a pressing and punching process.

REFERENCES:
patent: 4372046 (1983-02-01), Suzuki

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing a printed wiring board does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a printed wiring board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a printed wiring board will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-298443

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.