Method of manufacturing a printed circuit board

Details Method of manufacturing a printed circuit board Method of manufacturing a printed circuit board

1992-02-24

1993-03-23

Gorski, Joseph M.

Metal working

Method of mechanical manufacture

Electrical device making

H05K 322

Patent

active

051952386

ABSTRACT:
A method of manufacturing a printed circuit board comprises the steps of providing an insulating substrate for the printed circuit board, forming circuit patterns made of a conductive material on at least one side of the insulating substrate, forming an insulating layer on the circuit patterns, and adhering a cross-mesh shield layer onto at least a portion of the insulating layer in such a manner that a margin is placed both on the outer periphery of the insulating layer itself and around electric contacts such as lands and through-holes.

REFERENCES:
patent: 4528064 (1985-07-01), Ohsawa et al.
patent: 4604799 (1986-08-01), Gurol
patent: 4766268 (1988-08-01), Uggowitzer
patent: 4926007 (1990-05-01), Aufderheide et al.

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