Method of manufacturing a printed board assembly

Details Method of manufacturing a printed board assembly Method of manufacturing a printed board assembly

2006-05-30

2006-05-30

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C029S847000, C029S848000, C174S250000, C174S260000, C257S627000

Reexamination Certificate

active

07051430

ABSTRACT:
Methods of manufacturing a printed board assembly. In one embodiment, a substrate is coated with an electrically conducting material; electrical components are mounted on some areas of the substrate; non-conducting material is disposed in areas between the electrical components; the substrate, electrical components and non-conducting material are sandwiched between two sheets of resin coated conducting foil, wherein the resin on the foils faces the substrate and buries the electrical components; circuit patterns are etched in the exposed surfaces of the resin coated conducting foils; and, electrical connections are established between at least one of the resin coated conducting foils and the electronic components.

REFERENCES:
patent: 4306925 (1981-12-01), Lebow et al.
patent: 5191174 (1993-03-01), Chang et al.
patent: 5527741 (1996-06-01), Cole et al.
Wirlée S-O.; International-Type Search Report; Jul. 16, 1999; Search Request No. SE 98/01105; pp. 1-4.
http://www.merix.com/resourcecentr/tech/resinfoil.html; “Resin Coated Copper Foils”, 2 page.
http://www.fef.co.jp/en/res.htm; “Resin Coated Copper Foil”, 2 pages.

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