Method of manufacturing a pressure sensor assembly

Metal working – Method of mechanical manufacture – Electrical device making

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

29848, 29418, 26427211, H01R 4300

Patent

active

053774035

ABSTRACT:
A carrier frame has cells with inwardly extending thin flexible tabs. Pressure sensor housings are molded into the frame cells such that only the tips of the tabs penetrate the housing wall and after processing the housings are readily pushed out of the frame. A lead frame is insert molded at the same time. During molding the cells of the frame are open ended and after molding a reinforcing tie bar is attached across the open side of the frame to close the cells. A flange is bent up on the opposite side to lend rigidity to the frame. Preformed code flags are provided in the frame and selectively bent out for coding.

REFERENCES:
patent: 3899305 (1975-08-01), Hilger et al.
patent: 3913195 (1975-10-01), Beaver
patent: 4102039 (1978-07-01), Henrichson et al.
patent: 4295117 (1981-10-01), Lake et al.
patent: 4401053 (1983-08-01), Riley
patent: 4466183 (1984-08-01), Burns
patent: 4715118 (1987-12-01), Bernard et al.
patent: 4756193 (1988-07-01), Luettgen
patent: 4767984 (1988-08-01), Bakker
patent: 4820658 (1989-04-01), Gilber, Jr. et al.
patent: 4850227 (1989-07-01), Luettgen et al.
patent: 5085362 (1992-02-01), Art et al.
patent: 5228192 (1993-07-01), Salatino

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing a pressure sensor assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a pressure sensor assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a pressure sensor assembly will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2202063

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.