Method of manufacturing a power module

Details Method of manufacturing a power module Method of manufacturing a power module

2008-09-23

2008-09-23

Tugbang, A. Dexter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S604000, C029S841000, C264S272130, C264S272190

Reexamination Certificate

active

10985150

ABSTRACT:
A method of manufacturing a power module on a substrate. In one embodiment, the method includes providing power conversion circuitry including providing a magnetic device having a magnetic core and at least one switch on the substrate. The method also includes placing a shielding structure over the magnetic core to create a chamber thereabout. The method also includes depositing an encapsulant about the power conversion circuitry. The shielding structure limits the encapsulant entering the chamber thereby allowing the encapsulant to surround a portion of the magnetic core within the chamber.

REFERENCES:
patent: 3691497 (1972-09-01), Bailey et al.
patent: 4681718 (1987-07-01), Oldham
patent: 4847986 (1989-07-01), Meinel
patent: 4916522 (1990-04-01), Cohn
patent: 4975671 (1990-12-01), Dirks
patent: 5056214 (1991-10-01), Holt
patent: 5285369 (1994-02-01), Balakrishnan
patent: 5345670 (1994-09-01), Pitzele et al.
patent: 5353001 (1994-10-01), Meinel et al.
patent: 5469334 (1995-11-01), Balakrishnan
patent: 5574420 (1996-11-01), Roy et al.
patent: 5578261 (1996-11-01), Manzione et al.
patent: 5692296 (1997-12-01), Variot
patent: 5787569 (1998-08-01), Lotfi et al.
patent: 5802702 (1998-09-01), Fleming et al.
patent: 6005377 (1999-12-01), Chen et al.
patent: 6094123 (2000-07-01), Roy
patent: 6118351 (2000-09-01), Kossives et al.
patent: 6255714 (2001-07-01), Kossives et al.
patent: 6440750 (2002-08-01), Feygenson et al.
patent: 6479981 (2002-11-01), Schweitzer, Jr. et al.
patent: 6495019 (2002-12-01), Filas et al.
patent: 6541819 (2003-04-01), Lotfi et al.
patent: 6578253 (2003-06-01), Herbert
patent: 6624498 (2003-09-01), Filas et al.
patent: 6649422 (2003-11-01), Kossives et al.
patent: 6912781 (2005-07-01), Morrison et al.
patent: 6989121 (2006-01-01), Thummel
patent: 6998952 (2006-02-01), Zhou et al.
patent: 7015544 (2006-03-01), Lotfi et al.
patent: 7019505 (2006-03-01), Dwarakanath et al.
patent: 7038438 (2006-05-01), Dwarakanath et al.
patent: 7057486 (2006-06-01), Kiko
patent: 7101737 (2006-09-01), Cobbley
patent: 7180395 (2007-02-01), Lotfi et al.
patent: 7214985 (2007-05-01), Lotfi et al.
patent: 7230302 (2007-06-01), Lotfi et al.
patent: 7256674 (2007-08-01), Lotfi et al.
patent: 7276998 (2007-10-01), Lotfi et al.
patent: 7330017 (2008-02-01), Dwarakanath et al.
patent: 2001/0030596 (2001-10-01), Hamatani et al.
patent: 2003/0076662 (2003-04-01), Miehling
patent: 2005/0167756 (2005-08-01), Lotfi et al.
patent: 2005/0168203 (2005-08-01), Dwarakanath et al.
patent: 2005/0168205 (2005-08-01), Dwarakanath et al.
patent: 2005/0169024 (2005-08-01), Dwarakanath et al.
patent: 2006/0038225 (2006-02-01), Lotfi et al.
patent: 2006/0145800 (2006-07-01), Dadafshar et al.
patent: 2 041 818 (1980-09-01), None
patent: 2-228013 (1990-09-01), None
patent: 6-251958 (1994-09-01), None
Sato et al., “Influences of Molding Conditions on Die-pad Behavior in IC Encapsulation Process Analyzed by Hall Element Method”, IEEE Transactions on Advanced Packaging, vol. 23, No. 3, Aug. 2000, pp. 574-581.
U.S. Appl. No. 10/766,983, filed Jan. 29, 2004, Dwarakanath et al.
U.S. Appl. No. 10/767,540, filed Jan. 29, 2004, Dwarakanath et al.
U.S. Appl. No. 10/767,684, filed Jan. 29, 2004, Lotfi et al.
U.S. Appl. No. 10/767,937, filed Jan. 29, 2004, Dwarakanath et al.
U.S. Appl. No. 10/924,003, filed Aug. 23, 2004, Lotfi et al.
Betancourt-Zamora, R.J. et al., “A 1.5mW, 200 MHz CMOS VCO for Wireless Biotelemetry,” First International Workshop on Design of Mixed-Mode Integrated Circuits and Applications, Cancun, Mexico, pp. 72-74, Jul. 1997.
Goodman, J. et al., “An Energy/Security Scalable Encryption Processor Using an Embedded Variable Voltage DC/DC Converter,” IEEE Journal of Solid-State Circuits, vol. 33, No. 11 (Nov. 1998).
Horowitz, P., et al., “The Art of Electronics,” Second Edition, 1989, pp. 288-291, Cambridge University Press, Cambridge, MA.
Lotfi, A.W., et al., “Issues and Advances in High-Frequency Magnetics for Switching Power Supplies,” Proceedings of the IEEE, Jun. 2001, vol. 89, No. 6, pp. 833-845.

Affiliated with

Also associated with

Rating

Method of manufacturing a power module does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a power module, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a power module will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3909513