Method of manufacturing a power integrated circuit (PIC) structu

Details Method of manufacturing a power integrated circuit (PIC) structu Method of manufacturing a power integrated circuit (PIC) structu

1995-06-07

1997-01-07

Nguyen, Tuan H.

Fishing, trapping, and vermin destroying

437 34, 437 59, 437 75, H01L 2170

Patent

active

055916627

ABSTRACT:
A PIC structure comprises a lightly doped semiconductor layer of a first conductivity type, superimposed over a heavily doped semiconductor substrate of the first conductivity type, wherein a power stage and a driving and control circuitry including first conductivity type-channel MOSFETs and second conductivity type-channel MOSFETs are integrated; the first conductivity type-channel and the second conductivity type-channel MOSFETs are provided inside second conductivity type and first conductivity type well regions, respectively, which are included in at least one isolated lightly doped region of the first conductivity type completely surrounded and isolated from the lightly doped layer of the first conductivity type by means of a respective isolation region of a second conductivity type.

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