Etching a substrate: processes – Etching to produce porous or perforated article
Reexamination Certificate
2005-07-11
2010-10-05
Tran, Binh X (Department: 1713)
Etching a substrate: processes
Etching to produce porous or perforated article
C216S087000, C216S091000, C216S094000, C216S095000
Reexamination Certificate
active
07807066
ABSTRACT:
A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step 2 of etching treatment conducted by putting an etchant containing an alkali metal in contact with the wall face of each perforation; and Step 3 of putting an oxidizable compound or a solution thereof in contact with a degenerative layer generated by the etching treatment, and thereby removing the degenerative layer. A method of manufacturing a porous resin substrate in which electrical conductivity is afforded to the wall face of the perforation.
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Fujita Taro
Hayashi Fumihiro
Idomoto Yuichi
Masuda Yasuhito
Okuda Yasuhiro
McDermott Will & Emery LLP
Sumitomo Electric Industries Ltd.
Tran Binh X
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