Method of manufacturing a porous resin substrate having...

Etching a substrate: processes – Etching to produce porous or perforated article

Reexamination Certificate

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C216S087000, C216S091000, C216S094000, C216S095000

Reexamination Certificate

active

07807066

ABSTRACT:
A method of manufacturing a perforated porous resin substrate, the method including the following steps: Step 1 of forming at least one perforation penetrating in the thickness direction from a first surface to a second surface in a porous resin substrate made of a resin material containing a fluoropolymer; Step 2 of etching treatment conducted by putting an etchant containing an alkali metal in contact with the wall face of each perforation; and Step 3 of putting an oxidizable compound or a solution thereof in contact with a degenerative layer generated by the etching treatment, and thereby removing the degenerative layer. A method of manufacturing a porous resin substrate in which electrical conductivity is afforded to the wall face of the perforation.

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