Abrasive tool making process – material – or composition – Laminating
Reexamination Certificate
2000-12-11
2002-08-06
Marcheschi, Michael (Department: 1755)
Abrasive tool making process, material, or composition
Laminating
C051S298000, C051S307000, C051S296000, C051S295000, C051S303000, C451S451000, C451S526000, C451S533000, C428S314400, C428S317900, C428S313900, C428S313300, C428S313500, C428S316600
Reexamination Certificate
active
06428586
ABSTRACT:
FIELD OF THE INVENTION
The invention relates to manufacture of a polymer based polishing pad, particularly a polishing pad used for polishing semiconductor substrates.
BACKGROUND OF THE RELATED ART
U.S. Pat. No 6,099,954 discloses a known method of manufacturing a polishing pad for polishing semiconductor substrates, includes the step of; coagulating a layer of viscous polishing material in-situ, meaning, directly onto, a portion of the manufactured polishing pad. The polishing material is an elastomer or polymer that is coagulated and dried, in situ, on a backing layer in sheet form. The polishing material solidifies and adheres to the backing layer. Prior to the invention, batch processing was performed to manufacture a limited number of polishing pads. The polishing pads that were manufactured by one batch processing varied from those manufactured by another batch processing. A need exists for a manufacturing process that avoids variations in polishing pads that are manufactured according to different batches.
SUMMARY OF THE INVENTION
The invention provides a continuous manufacturing process, which eliminates batch processing and reduces variations among polishing pads that are manufactured according to different batches. A method of manufacturing a polishing pad that is used for polishing a semiconductor substrate, comprises the steps of; transporting a continuous material forming a transported backing layer through successive manufacturing stations, supplying a fluid phase polymer composition onto the transported backing layer, shaping the polymer composition on the transported backing layer into a surface layer having a measured thickness, curing the polymer composition on the transported backing material in a curing oven to convert the polymer composition to a solid phase polymer layer attached to the transported backing layer, the solid phase polymer layer providing a solid phase polishing layer of a polishing pad that is used for polishing semiconductor substrates.
REFERENCES:
patent: 4038047 (1977-07-01), Haywood
patent: 5863306 (1999-01-01), Wei et al.
patent: 5942015 (1999-08-01), Culler et al.
patent: 5958794 (1999-09-01), Bruxvoort et al.
patent: 6099954 (2000-08-01), Urbanavage et al.
patent: WO 94 04599 (1994-03-01), None
Benson Kenneth A.
Kaeding Konrad
Kita Gerald K.
Marcheschi Michael
Rodel Holdings Inc.
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