Method of manufacturing a plurality of semiconductor devices...

Details Method of manufacturing a plurality of semiconductor devices... Method of manufacturing a plurality of semiconductor devices...

2006-11-03

2010-06-15

Monbleau, Davienne (Department: 2893)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C029S829000, C438S455000, C438S458000, C257SE21506, C257SE21573, C257SE21600, C257SE21244, C257SE21237, C257SE21320

Reexamination Certificate

active

07736948

ABSTRACT:
Individual devices (100) are locally attached to a carrier substrate (10), so that they can be removed therefrom individually. This is achieved through the use of a patterned release layer, particularly a layer that is removable through decomposition into gaseous or vaporized decomposition products. The mechanical connection between the carrier substrate (10) and the individual devices (100) is provided by a bridging portion (43) of an adhesion layer (40).

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