Method of manufacturing a plurality of assemblies

Details Method of manufacturing a plurality of assemblies Method of manufacturing a plurality of assemblies

2007-10-16

2007-10-16

Geyer, Scott B. (Department: 2812)

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

C257SE21499

Reexamination Certificate

active

10494881

ABSTRACT:
A plurality of assemblies is manufactured. Each assembly comprises a sealing slice that is fixed to a base slice. The plurality of assemblies is manufactured in the following manner. In a preparation step, a stack is formed. The stack comprises a plurality of pre-assemblies. Each pre-assembly comprises a base slice, a sealing slice and a fixing layer provided between the base slice and the sealing slice. The stack further comprises at least one supple buffer layer. The supple buffer layer has a mechanical rigidity, which is substantially less than that of the base slices and that of the sealing slices. The supple buffer layer thus enables to compensate for variations in thickness of the base slices and of the sealing slices. In a fixing step, the stack is pressed which causes the sealing slice of each pre-assembly to be fixed to the base-slice of the pre-assembly.

REFERENCES:
patent: 6027958 (2000-02-01), Vu et al.
patent: 6398892 (2002-06-01), Noguchi et al.

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