Method of manufacturing a plastic encapsulated semiconductor dev

Details Method of manufacturing a plastic encapsulated semiconductor dev Method of manufacturing a plastic encapsulated semiconductor dev

1990-02-01

1991-01-01

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437219, 437214, H01L 2156, H01L 2160

Patent

active

049817760

ABSTRACT:
A semiconductor device has a lead frame. The lead frame has a mount portion and a lead portion. A semiconductor chip is mounted on one major surface of the mount portion of the lead frame. The semiconductor chip is connected by an electrical connecting means to the lead portion of the lead frame. An electrical insulating layer is formed on the other major surface of the mount portion of the lead frame. The mount portion, part of the lead portion of the lead frame, the semiconductor chip and the electrically connecting means, excluding the surface of the electrical insulating layer of the mount portion of the lead frame, are sealed or encapsulated by an electrical insulating member.

REFERENCES:
patent: 3629672 (1971-12-01), Van de Water
patent: 4339768 (1982-07-01), Keller et al.
patent: 4451973 (1984-06-01), Tateno et al.
patent: 4459607 (1984-07-01), Reid
patent: 4503452 (1985-03-01), Yokozawa et al.
patent: 4916518 (1990-04-01), Yoshimura et al.

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