Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Patent
1997-10-10
1999-10-26
Gorgos, Kathryn
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
C25D 502
Patent
active
059721936
ABSTRACT:
The present invention uses a glass to act as a substrate. A stencil layer is patterned on the top surface of the substrate. Successively, a copper layer is deposited over the substrate. Next step is to remove the stencil layer. A negative photoresist layer is formed on the copper layer. A negative photoresist layer is processed using a backside exposure of the resist through the transparent substrate. The backside exposure technique uses the self-aligning, conductive copper layer as a mask. A plurality of trenches are then created in the photoresist layer and a second copper layer is electroplated in the trenches to form the planar coils.
REFERENCES:
patent: 4022928 (1977-05-01), Piwcyzk
patent: 4721550 (1988-01-01), Schumacher, III
patent: 5200056 (1993-04-01), Cohen et al.
patent: 5327033 (1994-07-01), Guckel et al.
patent: 5356526 (1994-10-01), Frankenthal et al.
patent: 5516418 (1996-05-01), Doss et al.
patent: 5545307 (1996-08-01), Doss et al.
patent: 5547557 (1996-08-01), Aisa et al.
patent: 5549808 (1996-08-01), Farooq et al.
patent: 5580687 (1996-12-01), Leedy
patent: 5646464 (1997-07-01), Sickafus
Chou Min-Chieh
Huang Star Rey-Shing
Lin Yuh-Sheng
Wu Ching-Yi
Gorgos Kathryn
Industrial Technology Research Institute
Liauh W. Wayne
Smith-Hicks Erica
LandOfFree
Method of manufacturing a planar coil using a transparency subst does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing a planar coil using a transparency subst, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a planar coil using a transparency subst will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-759838