Method of manufacturing a piezoelectric element

Details Method of manufacturing a piezoelectric element Method of manufacturing a piezoelectric element

2008-08-15

2010-11-30

Tugbang, A. Dexter (Department: 3729)

Metal working

Piezoelectric device making

C029S830000, C310S321000, C310S348000

Reexamination Certificate

active

07841056

ABSTRACT:
A method of manufacturing a piezoelectric element includes: forming a first base substrate having an element to be transferred; forming a second base substrate; and transferring the element to the second base substrate. The forming of the element includes forming a first electrode above a first substrate, forming a piezoelectric layer above the first electrode, forming a second electrode above the piezoelectric layer, crystallizing the piezoelectric layer, forming a dielectric layer above the second electrode, and etching the dielectric layer such that part of the second electrode is exposed and the dielectric layer has a protrusion upwardly protruding relative to the second electrode. Forming the second base substrate includes forming a third electrode above a second substrate. The transferring includes bonding the element and the second base substrate such that the second substrate is in contact with the protrusion and the second electrode is in contact with the third electrode.

REFERENCES:
patent: 6666943 (2003-12-01), Wada et al.
patent: 6817073 (2004-11-01), Uchiyama et al.
patent: 6928731 (2005-08-01), Le et al.
patent: 05335864 (1993-12-01), None
patent: 10-125929 (1998-05-01), None

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