Method of manufacturing a PCB having improved cooling

Details Method of manufacturing a PCB having improved cooling Method of manufacturing a PCB having improved cooling

2006-11-22

2009-06-30

Arbes, C. J (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S825000, C029S840000, C029S852000

Reexamination Certificate

active

07552530

ABSTRACT:
An improved cooling of an electronic component loaded to a printed circuit board, wherein the PCB comprises at its upper side at least one electronic component, and at least one heat conducting member inserted into a through-hole of the PCB, wherein the HCM extends from the upper side to the lower side of the PCB and has a thermal contact to the components.

REFERENCES:
patent: 3484935 (1969-12-01), Burns
patent: 5172301 (1992-12-01), Schneider
patent: 5609746 (1997-03-01), Farrar et al.
patent: 5617294 (1997-04-01), Watson et al.
patent: 5920458 (1999-07-01), Azar
patent: 6018193 (2000-01-01), Rubens et al.
patent: 6219243 (2001-04-01), Ma et al.
patent: 6411516 (2002-06-01), Palumbo et al.
patent: 2005/0286238 (2005-12-01), Joy
patent: 42 20 966 (1994-01-01), None
patent: 199 16 010 (2000-04-01), None
patent: 0 907 307 (1999-04-01), None
patent: WO 01/01738 (2001-01-01), None
patent: WO 02/054477 (2002-07-01), None
European Search Report Application No. EP 03 10 1323 dated Sep. 16, 2003.

Affiliated with

Also associated with

Rating

Method of manufacturing a PCB having improved cooling does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a PCB having improved cooling, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a PCB having improved cooling will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4057082