Method of manufacturing a pattern of conductive fine-line films

Coating processes – Electrical product produced

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427 96, 427259, 427264, 101170, B05D 100

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053625137

ABSTRACT:
A pattern forming method comprises at least a lower pattern forming step for printing a setting ink on a substrate, a setting step for setting the setting ink, an upper layer pattern forming step for forming a metalo-organic compound paste layer on the lower layer pattern by a printing method, and a firing step for firing at high temperature to remove the lower layer pattern. In the upper layer pattern forming step, the metalo-organic compound paste is printed so that the metalo-organic compound paste may be divided on the hardened setting ink so as to fill up gaps of the lower layer pattern. Otherwise the metalo-organic compound paste is printed on the hardened setting ink, and the metalo-organic compound paste is mechanically cut off, before the metalo-organic compound paste is dried, on the hardened setting ink, thereby forming an upper layer pattern. The setting ink comprises a thermo-setting resin, a setting agent, and an organic solvent, with an amount of nonvolatile materials of 50 to 70 wt. %, or comprises a carbon powder, a thermo-setting resin, a setting agent and an organic solvent, with an amount of nonvolatile materials of 60 to 80 wt. %.

REFERENCES:
patent: 4479432 (1984-10-01), Masaki et al.
A publication in the "Advanced Hybrid Technology" report.
WPI Acc. No. 90-126293/17, abstract of European Patent EP 365169 to Enomoto et al., Apr. 1990.
WPI Acc. No. 90-038094/06, abstract of West German Patent No. 3924716 to Pinkasov, Feb. 1990.
A computer printout of "WPI Acc No: 90-038094/06".
Shimada et al., "Manufacturing of Fine-Line Films by Printing Technique", IMC 1990 Proceedings, Tokyo, May 30-Jun. 1, 1990, pp. 581-586.
A computer printout of "WPI Acc No: 90-126293/17".
"Printing Irregular Surfaces", European Plastics News, Oct. 1977, pp. 13-14.

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