Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2007-12-11
2007-12-11
Tucker, Philip (Department: 1734)
Etching a substrate: processes
Forming or treating thermal ink jet article
C118S247000, C216S067000, C216S056000, C216S063000, C216S062000, C216S079000, C216S094000, C216S095000, C216S099000, C216S041000
Reexamination Certificate
active
11116045
ABSTRACT:
A method of manufacturing a nozzle plate2is disclosed. The nozzle plate2has a plurality of nozzle openings22through each of which a droplet is adapted to be ejected. The method includes the steps of: preparing a processing substrate (silicon substrate10) constituted from silicon as a main material, the processing substrate having two major surfaces; providing a supporting substrate50for supporting the processing substrate onto one major surface of the processing substrate50; and forming the plurality of nozzle openings22on the other major surface of the processing substrate by subjecting the other major surface of the processing substrate to an etching process while the processing substrate is supported by the supporting substrate50.
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Communication from European Patent Office regarding counterpart application.
Arakawa Katsuji
Matsuo Yoshihide
Harness & Dickey & Pierce P.L.C.
McClelland Kimberly K
Seiko Epson Corporation
Tucker Philip
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