Etching a substrate: processes – Forming or treating thermal ink jet article
Reexamination Certificate
2007-12-04
2007-12-04
Alanko, Anita (Department: 1765)
Etching a substrate: processes
Forming or treating thermal ink jet article
C216S041000, C216S049000, C438S021000
Reexamination Certificate
active
11038200
ABSTRACT:
A method of manufacturing a nozzle assembly, the method comprising the steps of depositing a first dielectric layer18on a substrate16, depositing a first metal layer102at least partially on the first dielectric layer18, depositing a passivation layer20at least partially on the first dielectric layer18, depositing at least one sacrificial layer108, 112, depositing a second metal layer116, depositing a third metal layer124, depositing at least one further sacrificial layer120, 128, and a second dielectric layer132, and, depositing a third dielectric layer138.
REFERENCES:
patent: 4734718 (1988-03-01), Iwagami et al.
patent: 4736212 (1988-04-01), Oda et al.
patent: 5184344 (1993-02-01), Takeuchi et al.
patent: 5211806 (1993-05-01), Wong et al.
patent: 5665249 (1997-09-01), Burke et al.
patent: 5897789 (1999-04-01), Weber
patent: 5929877 (1999-07-01), Hetzer et al.
patent: 6183067 (2001-02-01), Matta
patent: 6227660 (2001-05-01), McClelland et al.
patent: 1118467 (2001-07-01), None
patent: 05-330041 (1993-12-01), None
patent: 406134986 (1994-05-01), None
patent: 04169238 (1998-06-01), None
patent: 10250091 (1998-09-01), None
patent: 10-305583 (1998-11-01), None
patent: 2001138540 (2001-05-01), None
Alanko Anita
Silverbrook Research Pty Ltd
LandOfFree
Method of manufacturing a nozzle assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing a nozzle assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a nozzle assembly will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3894213