Method of manufacturing a multiple pin heatsink device

Details Method of manufacturing a multiple pin heatsink device Method of manufacturing a multiple pin heatsink device

1994-12-19

1996-03-19

Cuda, Irene

Metal working

Method of mechanical manufacture

Heat exchanger or boiler making

165185, B23P 1500

Patent

active

054994500

ABSTRACT:
A multiple pin heatsink device with U-shaped wire elements mechanically swaged into channels of a base element is provided. In the manufacture of the multiple pin heatsink, pins of the U-shaped wire element are introduced into respective pin receiving holes present in the upper surface of a die member to expose the central portion of each wire element. A base element with channels that match the arrangement of the wire elements in the die member is applied with pressure to the exposed central portions of the wire elements to effectively swage and expand the central portions of the wire elements into the corresponding matching channels in the base member for permanent attachment of the wire elements to the base element. In addition, protrusions are provided on either side of the exposed central portion of the wire elements on the die to create indents in the base element to form retaining lips partially over the central portion of the wire elements to further prevent removal of the wire elements from the base element. The base element and wire elements connected thereto are removed from the die member to reveal the completed multiple pin heatsink device.

REFERENCES:
patent: 3327779 (1967-06-01), Jacoby
patent: 4709374 (1988-12-01), Jacoby
patent: 4733453 (1988-03-01), Jacoby
patent: 5224538 (1993-07-01), Jacoby
patent: 5406698 (1995-04-01), Lipinski

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