Method of manufacturing a multiple-chip semiconductor device wit

Details Method of manufacturing a multiple-chip semiconductor device wit Method of manufacturing a multiple-chip semiconductor device wit

1994-03-21

1995-08-01

Fourson, George

Fishing, trapping, and vermin destroying

437205, 437206, 437217, 437220, H01L 2128

Patent

active

054380219

ABSTRACT:
A multiple-chip semiconductor device of the present invention comprises a first and a second leadframes. The same package envelops a power semiconductor chip mounted on a power chip mounting area in the first leadframe and a control chip mounted on a control chip mounting area in the second leadframe. In the device, the second leadframe is made of metal material which is processed easier than the first leadframe, and/or is finished thinner than the first leadframe. Thus, the multiple-chip semiconductor device can effectively dissipate the heat producing in the power semiconductor chip.

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patent: 5057906 (1991-10-01), Ishigami
patent: 5147815 (1992-09-01), Casto
patent: 5313095 (1994-05-01), Tagawa et al.

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