Method of manufacturing a multilayered printed wiring board

Details Method of manufacturing a multilayered printed wiring board Method of manufacturing a multilayered printed wiring board

1995-06-02

1996-06-18

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

174255, 29846, H01K 310

Patent

active

055265642

ABSTRACT:
A multilayered printed wiring board includes a plurality of inner layer circuits, ground layers, first insulating layers, a second insulating layer, a surface layer circuit, and a parts mounting pad. The inner layer circuits are arranged parallel to each other in a flat manner in at least one inner layer. The ground layers are formed on and under the inner layer circuits to sandwich the inner layer circuits. The first insulating layers are respectively formed between the ground layers and the inner layer circuits to insulate the inner layer circuits from each other and the inner layer circuits from the ground layers. The second insulating layer is formed at least on an uppermost one of the ground layers and serving as a surface layer. The surface layer circuit is selectively formed on the second insulating layer. The parts mounting pad is formed at a predetermined region on the second insulating layer, has a recessed portion for fitting a lead portion of a mounting part therein, and is connected to the surface layer circuit. A method of manufacturing this printed wiring board is also disclosed.

REFERENCES:
patent: 4706167 (1987-11-01), Sullivan
patent: 4853277 (1989-08-01), Chant
patent: 4893216 (1990-01-01), Hagner
patent: 5061824 (1991-10-01), Alexander et al.
patent: 5136471 (1992-08-01), Inasaka
patent: 5274912 (1994-01-01), Olenick et al.
patent: 5313021 (1994-05-01), Sajji et al.
patent: 5320894 (1994-06-01), Hasegawa

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