Method of manufacturing a multilayer electronic component

Details Method of manufacturing a multilayer electronic component Method of manufacturing a multilayer electronic component

1994-04-13

1997-05-06

Hall, Carl E.

Metal working

Electric condenser making

Solid dielectric type

29854, 296021, H01R 4300

Patent

active

056259352

ABSTRACT:
In order to provide a multilayer electronic component which can reduce arrangement pitches for external electrodes, via holes filled up with conductive materials are provided in a mother laminate, which is obtained by stacking a plurality of insulating sheets with interposition of conductor films, in positions parted by cutting. The conductive materials define external electrodes of individual multilayer electronic components which are obtained by cutting the mother laminate. No specific step is required for forming the external electrodes, and characteristics of each multilayer electronic component can be efficiently measured in the state of the mother laminate.

REFERENCES:
patent: 4821007 (1989-04-01), Fields et al.
patent: 5140745 (1992-08-01), McKenzie, Jr.
patent: 5488765 (1996-02-01), Kubota et al.

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