Method of manufacturing a multilayer electronic component

Details Method of manufacturing a multilayer electronic component Method of manufacturing a multilayer electronic component

1998-10-26

1999-12-07

Derrington, James

Plastic and nonmetallic article shaping or treating: processes

Outside of mold sintering or vitrifying of shaped inorganic...

264614, 264618, 264639, 264669, 264670, 156 8912, 156 8914, 29 2542, C04B 3564

Patent

active

059978007

ABSTRACT:
A method of manufacturing a ceramic multilayer component, comprising electrically conductive and electrically insulating layers which are stacked in alternate arrangement in a multilayer structure, which method comprises the following steps:

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"Novel Structures by Microlayer Coextrusion- Talc-Filled PP, PC/SAN, and HDPE/LLDPE", Chad D. Mueller, et al. Polymer Engineering and Science, Feb. 1997, vol. 37, No. 2, pp. 355-362.

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