Metal working – Method of mechanical manufacture – Electrical device making
Patent
1996-06-11
1998-03-17
Echols, P. W.
Metal working
Method of mechanical manufacture
Electrical device making
29846, H05K 336
Patent
active
057273103
ABSTRACT:
A heat resistant multilayer circuit board used in the transportation environment in cars, boats, planes, etc, having two or more conductive layers, with at least two conductive layers electrically and mechanically connected by an interconnecting adhesive layer, at least one of the conductive layers being affixed to a heat resistant substrate. The interconnecting adhesive layer comprises a conductive adhesive material having a plurality of deformable, heat fusible metallic particles dispersed substantially throughout a non-conductive adhesive. The fabricated multilayer circuit boards have interconnections which are reliable, heat resistant, and capable of withstanding thermal cycling and typical circuit board finishing and assembly processes.
REFERENCES:
patent: 2808352 (1957-10-01), Coleman et al.
patent: 3148310 (1964-09-01), Feldman
patent: 3205299 (1965-09-01), Dickie
patent: 3320658 (1967-05-01), Bolda et al.
patent: 3334040 (1967-08-01), Conrad et al.
patent: 3359145 (1967-12-01), Salyer et al.
patent: 3421961 (1969-01-01), Joyce
patent: 3475213 (1969-10-01), Stow
patent: 3491056 (1970-01-01), Saunders et al.
patent: 3541222 (1970-11-01), Parks et al.
patent: 3680037 (1972-07-01), Nellis et al.
patent: 3774232 (1973-11-01), May
patent: 3795047 (1974-03-01), Abolafia et al.
patent: 3823252 (1974-07-01), Schmid
patent: 3883213 (1975-05-01), Glaister
patent: 3885173 (1975-05-01), Lee
patent: 3904934 (1975-09-01), Martin
patent: 3971610 (1976-07-01), Buchoff et al.
patent: 3982320 (1976-09-01), Buchoff et al.
patent: 4064623 (1977-12-01), Moore
patent: 4065197 (1977-12-01), Kuist et al.
patent: 4109377 (1978-08-01), Blazick et al.
patent: 4113981 (1978-09-01), Fujita et al.
patent: 4249302 (1981-02-01), Crepeau
patent: 4261042 (1981-04-01), Ishiwatari et al.
patent: 4388136 (1983-06-01), Huie et al.
patent: 4457796 (1984-07-01), Needham
patent: 4508990 (1985-04-01), Essinger
patent: 4511757 (1985-04-01), Ors et al.
patent: 4554033 (1985-11-01), Dery et al.
patent: 4581679 (1986-04-01), Smolley
patent: 4606962 (1986-08-01), Reylek et al.
patent: 4610756 (1986-09-01), Strobel
patent: 4628022 (1986-12-01), Ors et al.
patent: 4629681 (1986-12-01), Takada et al.
patent: 4642160 (1987-02-01), Burgess
patent: 4645552 (1987-02-01), Vitriol et al.
patent: 4659872 (1987-04-01), Dery et al.
patent: 4680226 (1987-07-01), Takeda
patent: 4713494 (1987-12-01), Oikawa et al.
patent: 4729809 (1988-03-01), Dery et al.
patent: 4737112 (1988-04-01), Jin et al.
patent: 4744850 (1988-05-01), Imano et al.
patent: 4751126 (1988-06-01), Oodaira et al.
patent: 4771537 (1988-09-01), Pryor et al.
patent: 4778635 (1988-10-01), Hechtman et al.
patent: 4788766 (1988-12-01), Burger et al.
patent: 4800461 (1989-01-01), Dixon et al.
patent: 4814040 (1989-03-01), Ozawa
patent: 4830878 (1989-05-01), Kaneko et al.
patent: 4897508 (1990-01-01), Mahulikar et al.
patent: 4926549 (1990-05-01), Yoshizawa et al.
patent: 5041183 (1991-08-01), Nakamura et al.
patent: 5046238 (1991-09-01), Daigle et al.
patent: 5479703 (1996-01-01), Desai et al.
patent: 5502889 (1996-04-01), Casson et al.
Adachi, Kohei, "Packaging Technology for Liquid Crystal Displays", Solid State Technology, Jan. 1993, pp. 63-71.
Bolger, "Conductive Adhesives", Handbook of Adhesives, pp. 705-712 (date unknown).
Excerpts from Compass Programme LCD materials, Technology/Market Update 5, pp. 5-14, pp. 11-14, and pp. 60-76 (1990).
Crea, John J., et al., "Development of a Z-Axis Adhesive Film for Flex Circuit Interconnects and Tab Outer Lead Bonding", Reprint NEPCON West '91 Proceedings, pp. 251-259.
Various Conductive Materials datasheets, Creative Materials Incorporated (1992-93).
In re Gilleo, Appeal No. 91-1326 (B.P.A.I. 1991).
Gilleo, "a New Multilayer Circuit Process Based on Anisotropicity", draft, published in Nepcon West proceeds, (Feb. 1991).
Gilleo, "Anisotropic Adhesives: Screen-printed Electronic Assembly" SITE, pp. 20-23 (Apr. 1988).
Grove, Bruce, interConnection Technology, Z-Axis Adhesive Film: Innovation in Electronic Interconnection, Dec. 1992.
Hitachi Anisotropic Conductive Film ANISOLM.TM. brochure.
Hitachi Anisotropic Conductive Film Anisolm AC-7073 product specifications (1993).
Kruetter, N.P., et al., "Effective Polymer Adhesives for Interconnect", 3M Austin, Tex.
Nipon Graphite Industries, Ltd. MONOSOTROPIC product brochure (1991).
"Pulse Heat Temperature Controller TC 1000" and Pulse Heat Thermal Compression Bonder RSM 4000 Elform product sheet.
Reinke, Roger R., "Interconnection Method of Liquid Crystal Driver LSIs by Tab-on-Glass and Board to Glass Using Anisotropic Conductive Films and Monosotropic Heat Seal Connectors", Elform, Incorporated, 41st Electronic Components and Technology Conference.
"Shel-zac.TM. Anisotropic Interconnect" Product Specification (Dec. 1991).
Sony Oriented Conduction Film Connectors CP1030 Technical Information brochure.
Sumitomo Bakelite Co., Ltd. Anisotropic Conductive Film SUMIZAC 1003 product brochure (1991).
3M, Scotch.TM. 9703 Conductive Adhesive Transfer Tape product brochure (1991).
"Z-link.RTM." Multilayer Technology Product Specification (date unknown).
Casson Keith L.
Gilleo Kenneth B.
Mahagnoul Edward
Myers Carol
Suilmann Deanna
Echols P. W.
Sheldahl Inc.
LandOfFree
Method of manufacturing a multilayer electronic circuit does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing a multilayer electronic circuit, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a multilayer electronic circuit will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-948116