Method of manufacturing a multilayer circuit board

Details Method of manufacturing a multilayer circuit board Method of manufacturing a multilayer circuit board

1990-03-15

1991-09-10

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

29739, 29848, 361412, 428422, H05K 336

Patent

active

050462385

ABSTRACT:
Methods of fabricating multilayer circuits are presented. In accordance with the present invention, a plurality of circuit layers comprised of a dielectric substrate having a circuit formed thereon are stacked, one on top of the other. The dielectric substrate is composed of a polymeric material capable of undergoing fusion bonding such as a fluoropolymeric based substrate. Fusible conductive bonding material (e.g. solder) is applied on selected exposed circuit traces (prior to the stacking step) whereupon the entire stack-up is subjected to lamination under heat and pressure to simultaneously fuse all of the substrate and conductive layers together to form an integral multilayer circuit having solid conductive interconnects.

REFERENCES:
patent: 3835531 (1974-09-01), Luttmer
patent: 4634631 (1987-01-01), Gazit et al.
patent: 4788766 (1988-12-01), Burger et al.
patent: 4818728 (1989-04-01), Rai et al.
patent: 4868350 (1989-09-01), Hoffarth et al.
IBM Tech Disclosure Bull., vol. 11, No. 8, Jan. 1969, p. 962, by K. Hermann.
IBM Tech. Disclosure Bull., vol. 12, No. 8, Jan. 1970, pp. 1191-1192, by Haddad.

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