Method of manufacturing a multi-layered wiring board

Details Method of manufacturing a multi-layered wiring board Method of manufacturing a multi-layered wiring board

1991-12-02

1993-11-23

Silverberg, Sam

Metal treatment

Process of modifying or maintaining internal physical...

Processes of coating utilizing a reactive composition which...

156281, 156314, B32B 3100

Patent

active

052640493

ABSTRACT:
A method of manufacturing a multi-layered wiring board, which is characterized in that the oxidation of a wiring layer for roughening the surface of the layer is performed by two steps (a) oxidizing a wiring layer of inner circuit plate with a first alkaline oxidizing solution thereby forming a first oxidized film comprising CuO and Cu.sub.2 O, then etching said first oxidized film to obtain a thinned first oxidized film, and (b) oxidizing said thinned first oxidized film with a second alkaline oxidizing solution thereby forming a second oxidized film enriched with Cu.sub.2 O.

REFERENCES:
patent: 5147492 (1992-09-01), Chen

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