Method of manufacturing a monolithic ceramic electronic device

Details Method of manufacturing a monolithic ceramic electronic device Method of manufacturing a monolithic ceramic electronic device

1996-03-18

1998-06-23

Mayes, Curtis

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156233, 156239, 264615, 264619, 29851, B32B 3126

Patent

active

057699852

ABSTRACT:
A method of manufacturing a monolithic ceramic electronic device includes the following steps: forming a first metal film on a PET film; forming a multilayered metal film by forming a second metal film on a part of the first metal film, the second metal film being thicker than the first metal film; forming a monolithic ceramic structure including the multilayered metal film; forming the first metal film, which is partially overlain by the second metal film in the monolithic ceramic structure, into an insulating structure in such a manner that metal components forming the first metal film are diffused into the ceramics; and firing the ceramics. Disclosed also is a monolithic ceramic electronic device manufactured by the method. As a result, a stepped portion between a portion in which the internal electrodes overlap one another and a portion in which the internal electrodes do not overlap can be prevented from being formed, and delamination can effectively be prevented, whereby a monolithic ceramic electronic device exhibiting stable characteristics and a method for manufacturing the monolithic ceramic electronic device can be obtained.

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