Method of manufacturing a monolithic ceramic electronic device

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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156 8912, 156233, 156235, 156239, 264618, 264619, 264674, 29851, B32B 3126

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active

059850680

ABSTRACT:
A method of manufacturing a monolithic ceramic electronic device includes the following steps: forming a first metal film on a PET film; forming a multilayered metal film by forming a second metal film on a part of the first metal film, the second metal film being thicker than the first metal film; forming a monolithic ceramic structure including the multilayered metal film; forming the first metal film, which is partially overlain by the second metal film in the monolithic ceramic structure, into an insulating structure in such a manner that metal components forming the first metal film are diffused into the ceramics; and firing the ceramics. Disclosed also is a monolithic ceramic electronic device manufactured by the method. As a result, a stepped portion between a portion in which the internal electrodes overlap one another and a portion in which the internal electrodes do not overlap can be prevented from being formed, and delamination can effectively be prevented, whereby a monolithic ceramic electronic device exhibiting stable characteristics and a method for manufacturing the monolithic ceramic electronic device can be obtained.

REFERENCES:
patent: 5009744 (1991-04-01), Mandai et al.
patent: 5072329 (1991-12-01), Galvagni
patent: 5304274 (1994-04-01), Crownover et al.
patent: 5700338 (1997-12-01), Kubodera et al.

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