Method of manufacturing a microwave intergrated circuit substrat

Details Method of manufacturing a microwave intergrated circuit substrat Method of manufacturing a microwave intergrated circuit substrat

1988-09-29

1991-06-18

Nimmo, Morris H.

Metal working

Method of mechanical manufacture

Electrical device making

174250, H05K 300

Patent

active

050239945

ABSTRACT:
A method of forming a microwave integrated circuit substrate which includes via holes connecting the upper and lower surfaces of the substrate in which the upper end of the via hole is closed by a conductive membrane.

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patent: 4712161 (1987-12-01), Pryor et al.
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patent: 4783248 (1988-11-01), Kohlhase et al.
patent: 4795670 (1989-01-01), Nishigaki et al.

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