Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2004-08-19
2008-10-14
Kim, Paul D (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S417000, C029S609100, C216S062000, C216S066000, C381S170000, C381S355000, C381S358000, C381S360000, C381S368000
Reexamination Certificate
active
07434305
ABSTRACT:
A silicon condenser microphone package is disclosed. The silicon condenser microphone package comprises a transducer unit, substrate, and a cover. The substrate includes an upper surface having a recess formed therein. The transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and includes an aperture.
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Kim Paul D
Knowles Electronics LLC.
Marshall & Gerstein & Borun LLP
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