Method of manufacturing a microcomponent assembly

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

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C029S840000, C029S846000, C257S678000, C361S803000, C439S065000, C439S329000, C977S724000

Reexamination Certificate

active

07096568

ABSTRACT:
A new process and structure for microcomponent interconnection utilizing a post-assembly activated junction compound. In one embodiment, first and second microcomponents having respective first and second contact areas are provided. A junction compound is formed on one of the first and second contact areas, and the first and second contact areas are positioned adjacent each other on opposing sides of the junction compound. The junction compound is then activated to couple the first and second microcomponents.

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