Method of manufacturing a metallic component or substrate with b

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler

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205109, 205110, 205228, 427203, 427205, 4273766, 4273768, 428614, C25D 550, C25D 1500, C23C 2800

Patent

active

056603207

ABSTRACT:
A metallic alloy part having a bonded coating that includes dispersed hard-material particles embedded in a metal matrix, composed of a eutectic solder whose alloy elements include at least the base metal of the metallic alloy part. The solder is formed by fusion bonding on the metallic alloy part, a precoating composed of sequential layers of the elemental components of the solder applied on the metal part or on the hard-material particles. The composition and disposition of the various layers are graduated such that the melting points of the elemental solder components increase towards the outermost layer.

REFERENCES:
patent: 3743556 (1973-07-01), Breton et al.
patent: 4116689 (1978-09-01), Kaarlela
patent: 4169020 (1979-09-01), Stalker et al.
patent: 4608128 (1986-08-01), Farmer et al.
patent: 4627896 (1986-12-01), Nazmy et al.

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