Method of manufacturing a metal-ceramic circuit board

Details Method of manufacturing a metal-ceramic circuit board Method of manufacturing a metal-ceramic circuit board

2006-06-20

2009-02-10

Vo, Peter (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S832000, C029S840000, C029S841000, C029S842000

Reexamination Certificate

active

07487585

ABSTRACT:
A metal-ceramic circuit board is characterized by being constituted by bonding on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal member for an electronic circuit. A method of manufacturing a metal-ceramic circuit board is characterized by comprising the steps of melting aluminum or aluminum alloy in a vacuum or inert gas atmosphere to form a molten metal, contacting one surface of a ceramic substrate board directly with the molten metal in a vacuum or inert gas atmosphere, cooling the molten metal and the ceramic substrate board to form a base plate of aluminum or aluminum alloy, which is bonded directly on the ceramic substrate board without forming any oxidizing film therebetween and bonding a conductive metal member for an electronic circuit on the ceramic substrate board by using a brazing material. The base plate has a proof stress not higher than 320 (MPa) and a thickness not smaller than 1 mm.

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