Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate
2005-09-06
2005-09-06
Arbes, Carl J. (Department: 3729)
Metal working
Method of mechanical manufacture
Electrical device making
C029S831000, C029S832000, C029S840000, C029S842000, C029S843000
Reexamination Certificate
active
06938333
ABSTRACT:
A metal-ceramic circuit board is characterized by being constituted by bonding on a base plate of aluminum or aluminum alloy at least one of ceramic substrate boards having a conductive metal member for an electronic circuit. A method of manufacturing a metal-ceramic circuit board is characterized by comprising the steps of melting aluminum or aluminum alloy in a vacuum or inert gas atmosphere to form a molten metal, contacting one surface of a ceramic substrate board directly with the molten metal in a vacuum or inert gas atmosphere, cooling the molten metal and the ceramic substrate board to form a base plate of aluminum or aluminum alloy, which is bonded directly on the ceramic substrate board without forming any oxidizing film therebetween and bonding a conductive metal member for an electronic circuit on the ceramic substrate board by using a brazing material. The base plate has a proof stress not higher than 320 (MPa) and a thickness not smaller than 1 mm.
REFERENCES:
patent: 3852877 (1974-12-01), Ahn et al.
patent: 3994430 (1976-11-01), Cusano et al.
patent: 4284437 (1981-08-01), Baba et al.
patent: 4531044 (1985-07-01), Chang
patent: 4592781 (1986-06-01), Cheney et al.
patent: 4762553 (1988-08-01), Savage et al.
patent: 4901137 (1990-02-01), Sato et al.
patent: 4906812 (1990-03-01), Nied et al.
patent: 4962291 (1990-10-01), Fujita et al.
patent: 4987677 (1991-01-01), Tanaka et al.
patent: 5672848 (1997-09-01), Komorita et al.
patent: 5707715 (1998-01-01), deRochemont et al.
patent: 5767576 (1998-06-01), Kobayashi et al.
patent: 6033787 (2000-03-01), Nagase et al.
patent: 6040039 (2000-03-01), Ikeda et al.
patent: 6110297 (2000-08-01), Hayashi et al.
patent: 6123895 (2000-09-01), Yamagata et al.
patent: 6175084 (2001-01-01), Saitoh et al.
patent: 6197435 (2001-03-01), Tsujimura et al.
patent: 0676800 (1995-10-01), None
patent: 0788153 (1997-08-01), None
patent: 0827198 (1998-03-01), None
patent: 11226717 (1999-08-01), None
patent: 118588/89 (1992-07-01), None
patent: 147411/88 (1997-02-01), None
Special Metals Corporation, Nimonic® alloy 91, pp. 1-8, Apr. 2004.
Furo Masahiro
Osanai Hideyo
Arbes Carl J.
Dowa Mining Co. Ltd.
Nguyen Tai
Patterson Thuente Skaar & Christensen P.A.
LandOfFree
Method of manufacturing a metal-ceramic circuit board does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Method of manufacturing a metal-ceramic circuit board, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a metal-ceramic circuit board will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3404531