Method of manufacturing a memory card package

Details Method of manufacturing a memory card package Method of manufacturing a memory card package

1998-02-13

2000-02-01

Yao, Sam Chaun

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156196, 156245, 1563082, 264275, 264279, 2643281, B32B 3114

Patent

active

RE0365408

ABSTRACT:
A process by which a package for a memory card is manufactured. The package comprises chiefly two stamped steel covers, (an upper and a lower cover half), each secured to a plastic frame element. The cover halves are secured by extended fingers which wrap around the plastic frame. This provides a double layer of metal at the perimeter of the frame. The two cover halves are situated so as to encapsulate the subject PCB and to affix it in its proper position. The two cover halves are then welded together using sonic welding on the plastic frame. The package has been designed to meet all PCMCIA standards, including polarizing keys and grounding points.

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English Language Translation of JP 4-107191.

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