Method of manufacturing a magnetic write head mold for neck...

Metal working – Method of mechanical manufacture – Electrical device making

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C216S039000, C216S042000, C427S404000, C427S419200

Reexamination Certificate

active

07975366

ABSTRACT:
A process to reduce the bevel angle in a mold used to form a write head is disclosed. First, tantalum is used instead of alumina for the yoke area. Then both the tantalum and the alumina areas are simultaneously subjected to reactive ion etching, leading to sloping sidewalls in the alumina area (write pole) while providing near vertical sidewalls in the tantalum (yoke) area. Consequently, the neck height is the same at the cavity floor as it is at the cavity top.

REFERENCES:
patent: 4656546 (1987-04-01), Mallory
patent: 4672493 (1987-06-01), Schewe
patent: 6504675 (2003-01-01), Shukh et al.
patent: 6510024 (2003-01-01), Otsuka et al.
patent: 6614620 (2003-09-01), Tagawa et al.
patent: 6821717 (2004-11-01), Lin et al.
patent: 6854175 (2005-02-01), Sasaki
patent: 2002/0041465 (2002-04-01), Sasaki
patent: 2004/0175596 (2004-09-01), Inomata et al.
patent: 61162844 (1986-07-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing a magnetic write head mold for neck... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a magnetic write head mold for neck..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a magnetic write head mold for neck... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2736924

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.