Method of manufacturing a light emitting diode

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437121, 437905, 437906, 437904, 148DIG66, 148DIG119, H01L 2120

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057078912

ABSTRACT:
A method of manufacturing a light emitting diode, which includes the steps of bringing a semiconductor substrate of p-type or n-type into contact with a growth solution at a high temperature and thereafter, lowering the temperature so as to form a monocrystalline epitaxial layer of the same type as the semiconductor substrate on the semiconductor substrate, subsequently, further lowering the above temperature to form a first monocrystalline epitaxial layer of a reverse type to the epitaxial layer on the epitaxial layer and then, cutting off the growth solution to form an epitaxial wafer as a result, a growth solution to contact the first epitaxial layer of a epitaxial wafer at a high temperature, and thereafter, the temperature is lowered to form a second monocrystalline epitaxial layer of the same kind and type as the first epitaxial layer on the first epitaxial layer.

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O.G. Lorimer, et al "Very High Efficiency GaP. Green Light Emitting Diodes" J Electrochem. Soc (USA) vol. 122, No. 3(3/75).
Thin Film Process, edited by J. Vossen and W. Kern, RCA Laboratores, Academic Press 1978.

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