Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Patent
1997-12-08
2000-08-15
Niebling, John F.
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Including adhesive bonding step
438 15, 438613, H01L 2144
Patent
active
06103553&
ABSTRACT:
Disclosed is a substrate used in performing a burn-in test of the integrated circuit chip prior to packaging the chip and a method for manufacturing a known good die using the same. The substrate includes a body having a plurality of through holes; a plurality of metal lines formed on one surface of the body and electrically connected to a plurality of bonding pads of the integrated circuit chip; and a plurality of pins each inserted into the respective corresponding holes and electrically connected to the respective corresponding metal lines and also projected from a surface opposite to the surface on which the metal lines of the substrate are formed. Moreover, the method of manufacturing a known good die includes performing a burn-in test in a state in which the integrated circuit chip is adhered to the substrate such that the bonding pads of integrated circuit chip are electrically connected to the metal lines of the substrate. After the performance of the burn-in test, the integrated circuit chip is separated from the substrate.
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Hyundai Electronics Industries Co,. Ltd.
Murphy John
Niebling John F.
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