Method of manufacturing a hybrid integrated circuit device

Details Method of manufacturing a hybrid integrated circuit device Method of manufacturing a hybrid integrated circuit device

2005-12-13

2005-12-13

Thompson, Craig A. (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

Reexamination Certificate

active

06974727

ABSTRACT:
In a molding process, a hybrid integrated circuit substrate is fixed the position of the substrate in a thickness direction. A leadframe is connected, with an upward inclination, to a hybrid integrated circuit substrate and transported into a mold cavity. By horizontally fixing the leadframe by mold dies, the hybrid integrated circuit substrate inclined upward is urged downward by a pushpin. This can fix the position of the hybrid integrated circuit substrate within the mold cavity and integrally transfer-molded.

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patent: 959494 (1999-11-01), None
patent: 02171219 (1990-07-01), None
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