Method of manufacturing a high lead count circuit board

Details Method of manufacturing a high lead count circuit board Method of manufacturing a high lead count circuit board

1991-05-15

1993-04-27

Chaudhuri, Olik

Fishing, trapping, and vermin destroying

437217, 437218, 437220, 361421, 29827, H01L 2152, H01L 2156, H01L 2158, H01L 2160

Patent

active

052061884

ABSTRACT:
A method for mounting an electronic component comprising providing an electrically insulating substrate having a recess for mounting the electronic component therein, a plurality of first leads disposed in the substrate side-by-side with a space therebetween and a plurality of second leads disposed between the first leads. Each first lead has an outer end projecting outwardly from the substrate and an inner end embedded within the substrate. Each second lead has an outer end outwardly extending from the substrate and an inner end exposed within the recess so that an electrical connection to the electronic component can be provided. One surface of the substrate has attached thereto a plurality of conductors, each having an outer end and an inner end disposed close to the recess for electrical connection to the electronic component. The inner ends of the first leads are connected to the outer ends of the conductors by through-hole conductors which penetrate the substrate.

REFERENCES:
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patent: 4949225 (1990-08-01), Sagisaka et al.
patent: 5022960 (1991-06-01), Takeyama et al.
patent: 5088008 (1992-02-01), Takeyama et al.
patent: 5099395 (1992-03-01), Sagisaka et al.

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