Method of manufacturing a heat sink pedestal device with...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C324S750090

Reexamination Certificate

active

07986155

ABSTRACT:
A heat sink pedestal device allows for the use of generic thermal units such as heat sinks. An interposer configured to fit a specific device under test is mounted to a retainer. The retainer firmly holds the interposer in position. In addition, the retainer may be mounted to a thermal unit. An interface sealant with a diameter less than that of the interposer, creating the perimeter of an interface medium chamber, is positioned at the periphery of the interposer between the interposer and the thermal unit. Interface material, having high thermal conductive properties, is positioned within the interface sealant. The interface medium chamber provides a high thermally conductive interface between the interposer and the thermal unit. In addition, the heat sink pedestal device minimizes customization because it allows a single heat sink or thermal unit assembly to be used to accommodate a wide range of unit sizes.

REFERENCES:
patent: 4839587 (1989-06-01), Flatley et al.
patent: 5821505 (1998-10-01), Tustaniwskyj et al.
patent: 6198630 (2001-03-01), Cromwell
patent: 6389225 (2002-05-01), Malinoski et al.
patent: 6447322 (2002-09-01), Yan et al.
patent: 6476627 (2002-11-01), Pelissier et al.
patent: 6489793 (2002-12-01), Jones et al.
patent: 6570398 (2003-05-01), Murphy et al.
patent: 6919734 (2005-07-01), Saito et al.
patent: 6937044 (2005-08-01), Agahdel et al.
patent: 2003/0057980 (2003-03-01), Murphy et al.
IBM Technical Disclosure Bulletin, IBM Corp., “Interposer for Tab Thermal Control,” vol. 31, No. 6, Nov. 1988, pp. 364-366.
Xie et al., “Packaging the Itanium Microprocessor,” 2002 Proceedings 52nd, Electronic Components and Technology Conference, May 28-31, 2002, pp. 583-589.
Mok, “Thermal Management of Silicon-Based Multichip Modules,” Semiconductor Thermal Measurement and Management Symposium, Feb. 1994, pp. 59-63.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of manufacturing a heat sink pedestal device with... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of manufacturing a heat sink pedestal device with..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of manufacturing a heat sink pedestal device with... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2681821

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.