Method of manufacturing a heat dissipating device

Details Method of manufacturing a heat dissipating device Method of manufacturing a heat dissipating device

2006-05-23

2006-05-23

Vo, Peter (Department: 3726)

Metal working

Method of mechanical manufacture

Heat exchanger or boiler making

C029S890032, C029S890040, C029S890041, C029S890043, C029S890054, C165S104210, C165S104260, C165S104330, C228S165000, C228S182000, C228S245000, C228S246000

Reexamination Certificate

active

07047640

ABSTRACT:
A method of manufacturing a heat dissipating device, the method includes steps: a) affording a heat pipe, a solid solder bar and a heat sink, wherein the heat sink includes a base defining a groove at a side thereof; b) placing the solder bar and the heat pipe, in turn, into the groove of the heat sink; c) heating to melt the solder bar and simultaneously pressing the heat pipe to have an outer surface of the heat pipe coplanar with said side where the groove is defined; and d) cooling to achieve the heat dissipating device wherein the solder bar is evenly distributed between the heat pipe and the base.

REFERENCES:
patent: 5385289 (1995-01-01), Bloch et al.
patent: 6321452 (2001-11-01), Lin
patent: 6435266 (2002-08-01), Wu
patent: 6651732 (2003-11-01), Sagal
patent: 2005/0067149 (2005-03-01), Wu

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