Method of manufacturing a head assembly

Details Method of manufacturing a head assembly Method of manufacturing a head assembly

1995-10-30

1998-10-13

Hall, Carl E.

Metal working

Method of mechanical manufacture

Electrical device making

2960315, G11B 542

Patent

active

058193960

ABSTRACT:
A head assembly for use in a VCR includes a head base, a head chip comprised of a first non-magnetic substrate block, a magneto-resistive head, a thin film head, and a second non-magnetic substrate block, an FPCB attached to the magneto-resistive head, and an FPCB attached to the thin film head. Such a head assembly can record or reproduce high density magnetic signals by virtue of the very small magnetic gaps incorporated therein. Such a head assembly can be manufactured by forming the magneto-resistive and thin film heads on a substrate wafer using layering processes. In the alternative, the magneto-resistive head and the thin film head can be formed on separate substrate wafers by using layering processes, and then combined to produce a head chip.

REFERENCES:
patent: 4546541 (1985-10-01), Reid

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