Method of manufacturing a Group II-VI semiconductor device havin

Metal treatment – Process of modifying or maintaining internal physical... – Chemical-heat removing or burning of metal

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148172, 148186, 148189, 29569L, 156616R, H01L 21368, H01L 21383, H01L 21388

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046197184

ABSTRACT:
A method of manufacturing a semiconductor device by the use of a Group II-VI compound semiconductor crystal prepared by liquid growth method using a temperature difference technique under controlled vapor pressure of the crystal-constituting Group VI element. Thus, the concentration of vacancies and other defects acting as donor is reduced as compared with the concentration of the p type impurity to be introduced. This invention is suitable for producing light-emitting diodes emitting a light of short-wave lengths.

REFERENCES:
patent: 3615877 (1971-10-01), Yamashita
patent: 3870473 (1975-03-01), Kyle
patent: 4190486 (1980-02-01), Kyle
patent: 4389256 (1983-06-01), Nishizawa et al.
patent: 4465527 (1984-08-01), Nishizawa
patent: 4526632 (1985-07-01), Nishizawa
Jun-ichi Nishizawa et al., Effects of Vapor Pressure on GaP LED's Japanese Journal of Applied Physics, vol. 17 (1978), Supplement 17-1, pp. 87-92.
Washiyama et al., Electronic Materials EFM-78-12, The Institute of Electrical Engineers of Japan, Tokyo, Japan, Nov. 29, 1978, pp. 1-9.
Nishizawa et al., Journal of Crystal Growth, vol. 31 (1975), pp. 215-222.

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