Method of manufacturing a field effect transistor having an...

Semiconductor device manufacturing: process – Having metal oxide or copper sulfide compound semiconductor...

Reexamination Certificate

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C438S149000, C257SE21046

Reexamination Certificate

active

07968368

ABSTRACT:
A method of manufacturing a field effect transistor, which has high alignment accuracy between a gate electrode and source and drain electrodes and can provide a transparent device at a low cost. Since a patterned light blocking film is formed on the rear side of a substrate and used as a photomask for forming a gate electrode pattern and a source and drain electrode pattern on the front side of the substrate, the number of photomasks is reduced, and self-alignment between the gate electrode and the source and drain electrodes is carried out, thereby improving the alignment accuracy of these electrodes. Thereby, a method of manufacturing a high-accuracy low-cost field effect transistor can be provided.

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patent: 2003/0143784 (2003-07-01), Nishitani et al.
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patent: 2010/0210070 (2010-08-01), Wakana et al.
patent: 2000-150900 (2000-05-01), None
patent: 2005-268724 (2005-09-01), None

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