Method of manufacturing a device package

Details Method of manufacturing a device package Method of manufacturing a device package

2006-02-14

2006-02-14

Chaudhari, Chandra (Department: 2891)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S617000

Reexamination Certificate

active

06998295

ABSTRACT:
A small ball is formed at an end of a second gold wire that is held and guided by a second capillary. The small ball has a diameter approximately equal to that of a first gold wire. The small ball is bonded to an electrode on an optical device. The second gold wire is separated from the small ball. A large ball is formed at the lower end of the first gold wire, which is held and guided by a first capillary. The large ball is bonded to a wiring pattern on a external wiring substrate. The first capillary is moved upward, and then moved toward the small ball in the horizontal direction. The first gold wire is connected to the large ball. The first gold wire is bonded to the small ball by stitch bonding, and then separated from the small ball.

REFERENCES:
patent: 4974767 (1990-12-01), Alfaro et al.
patent: 6091140 (2000-07-01), Toh et al.
patent: 6756252 (2004-06-01), Nakanishi
patent: 5-90320 (1993-04-01), None

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